Wing Ng

Dr. Wing Ng is a Hong Kong-origin semiconductor physicist and co-founder of Intrinsic Semiconductor Technologies, the UCL spinout developing silicon oxide memristor technology to solve the embedded memory bottleneck holding back the next generation of AI and IoT devices. He holds a PhD in semiconductor physics from the University of Sheffield, where much of his doctoral work was carried out at the National Centre for III-V Technologies and resulted in the first broadband quantum cascade laser operating above room temperature — a landmark achievement in photonics research. He subsequently joined UCL's Department of Electronic and Electrical Engineering as a Senior Research Fellow, building over 15 years of expertise in the design and fabrication of novel semiconductor electronic and optoelectronic structures at the nanoscale, spanning memory devices, semiconductor lasers, and nano-electromechanical (NEMS) systems for optical storage applications.

At UCL, Ng became a key collaborator in the research group led by Professor Tony Kenyon that pioneered silicon oxide (SiOx) memristor technology — a form of resistive random-access memory (RRAM) that uses conductive filaments composed of oxygen vacancies to switch between high and low resistance states. Unlike conventional Flash memory, which is reaching the limits of its scalability and cannot be easily integrated on the same chip as modern processors, Intrinsic's SiOx memristors are based on the same materials already used in CMOS semiconductor manufacturing. This means they can be integrated directly onto chips using standard fabrication processes, eliminating the cost, complexity, and power overhead of two-chip solutions. Ng co-founded Intrinsic in 2017 alongside Professor Kenyon and Dr. Adnan Mehonic to bring this technology to market.

As Head of Process and Device Engineering at Intrinsic, Ng leads the fabrication and device development work that sits at the core of the company's technology roadmap. Intrinsic raised a £1.35 million seed round in 2021 led by the UCL Technology Fund and IP Group, enabling a partnership with imec — one of the world's leading semiconductor research foundries — to validate the technology at 50nm node sizes on 300mm silicon wafers. The company followed this with a £7 million Series A in 2023 led by Octopus Ventures, supported by Innovate UK, the UCL Technology Fund, and IP Group, to expand its engineering team and bring its embedded RRAM IP to market as a licensable technology for chip manufacturers targeting edge AI, IoT, and microcontroller applications.